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毕科玻璃烧结工艺,金属封装外壳

New Product

Release Time:2024.07.15

本系列产品是使用金属作为壳体或底座,芯片直接或通过基板安装在外壳或底座上,引线穿过金属壳体或底座采用玻璃-金属封接技术的一种电子封装形式。

可广泛应用于光通信、航空航天、石油化工工业、汽车、医疗等领域。

产品特点:

——可靠性高

——机械强度高

——散热好

——电磁屏蔽性优良

——密封性好

——集成度高

默认标题__2024-07-15+14_51_57.jpg

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